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由美国电气电子工程师学会(IEEE)所属电子元件、混合集成电路和制造工艺学会(CHMTS)和美国电子工业协会(E1A)共同主办的第35届电子元件会议,五月二十二日至二十二在美国华盛顿市召开。今年我国第二次派人参加,一行七人由电子元器件工业管理局和中国电子学会电子元件学会共同派出。成员有郑浩、章士瀛、吴玉行、李兴教、印忠义、王宝善、汪福章。五月二十三日至三十日在纽约、新泽西州、洛山矾、圣地亚哥、旧金山参观了五家工厂。 本届会议宣读了86篇论文,按15个学组
The 35th Electronic Components Conference, co-hosted by the Institute of Electrical and Electronics Engineers (IEEE) Electronic Components, Hybrid Integrated Circuits and Manufacturing Technology Institute (CHMTS) and the American Electronics Industry Association (E1A), May 22 to 20 Second held in Washington, USA. This year our country sent people to participate for the second time. One delegation of seven people were jointly dispatched by the Electronic Components Industry Administration and the Institute of Electronic Components of the Chinese Institute of Electronics. Members have Zheng Hao, Zhang Shiyang, Wu Yuhang, Li Xingjiao, Yin Zhongyi, Wang Baoshan, Wang Fu Zhang. From May 23 to May 30, five factories were visited in New York, New Jersey, Los Angeles, San Diego and San Francisco. This session read 86 papers, according to 15 school groups