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半导体设备用输送高纯度气体的配管大多数使用高纯度 Ｓ Ｕ Ｓ ３１６ Ｌ 钢管。伴随半导体集成化程度的提高， 对使用的配管材料提出了愈来愈高的要求。为了不使配管自身成为污染源，要把非金属夹杂物降低到最低限度； 为抑制焊接时产生有害气体， 也要求提高钢管的纯净度。新开发的 Ｋ Ｓ ００７ 不锈钢， 就是采用 Ｖ Ｉ Ｍ － Ｅ Ｓ Ｒ－ Ｅ Ｓ Ｒ 三重熔炼法生产的， 可以满足上述要求的超高纯度 Ｓ Ｕ Ｓ３１６ Ｌ钢。为适应更恶劣的腐蚀环境， 又在 Ｙ Ｕ Ｓ ２７０ 钢 （２０ Ｃｒ－ １８ Ｎｉ－ ６ Ｍｏ） 的基础上， 开发出高纯度的 Ｋ Ｓ ２７０ 钢管。
Piping for conveying high-purity gases for semiconductor equipment mostly uses high-purity SUS U 316L steel pipe. With the increasing degree of semiconductor integration, the use of piping materials put forward higher and higher requirements. In order not to make the pipe itself as a source of pollution, non-metallic inclusions should be reduced to a minimum; to suppress the production of harmful gases welding, also called for improving the purity of steel. The newly developed K S 007 stainless steel is an ultra-high-purity S U S316 L steel produced by the V I M - E S R - E S R triple melting process that meets the above requirements. In order to cope with the harsher corrosive environment, a high-purity K S 270 steel tube was developed on the basis of YS 270 steel (20 Cr-18 Ni-6 Mo).