A modeling method of semiconductor fabrication flows with extended knowledge hybrid Petri nets

• 作 者: 周炳海
• 机 构: School of Mechanical Engineering,Shanghai Jiaotong University,Shanghai 200240,P.R.China,
• 出 处: High Technology Letters
• 发表日期: 2008年01期
• 关键词: fabrication wafer illustrate coping token essing etching litho message esses

A modeling method of extended knowledge hybrid Petri nets(EKHPNs),incorporating object-ori-ented methods into hybrid Petri nets(HPNs),was presented and used for the representation and modelingof semiconductor wafer fabrication flows.To model the discrete and continuous parts of a complex semi-conductor wafer fabrication flow,the HPNs were introduced into the EKHPNs.Object-oriented methodswere combined into the EKHPNs for coping with the complexity of the fabrication flow.Knowledge anno-tations were introduced to solve input and output conflicts of the EKHPNs.Finally,to demonstrate the va-lidity of the EKHPN method,a real semiconductor wafer fabrication case was used to illustrate the model-ing procedure.The modeling results indicate that the proposed method can be used to model a complexsemiconductor wafer fabrication flow expediently.

A modeling method of extended knowledge hybrid Petri nets (EKHPNs), incorporating object-ori-ented methods into hybrid Petri nets (HPNs), was presented and used for the representation and modeling of semiconductor wafer fabrication flows.To model the discrete and continuous parts of a complex semi-conductor wafer fabrication flow, the HPNs were introduced into the EKHPNs.Object-oriented methodswere combined into the EKHPNs for coping with the complexity of the fabrication flow. Snownow anno-tations were introduced to solve input and output conflicts of the EKHPNs .Finally, to demonstrate the va-lidity of the EKHPN method, a real semiconductor wafer fabrication case was used to illustrate the model-ing procedure. The modeling results indicate that the proposed method can be used to model a complex semiconductor wafer fabrication flow expediently.