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半导体工艺技术不断精进,IC设计产业却苦于没有足够的市场规模,以支撑产品开发费用。据IC设计业者指出,在0.35微米制造工艺时代,新产品的开发费用仅需100万美元左右;因此只要市场规模达到1,000万美元便足以支应。然而,随着半导体制造工艺迈入12英寸基片、0.13微米的时代,由于制造工艺成本大幅提高,导致新产品的市场规模必须达到1亿美元始能支撑开发费用。在新的应用不足以形成庞大需求(明星产品只会偶而出现),而业者又一窝蜂投入的情况下,要为新产品创造出1亿美元的营收谈何容易?! 虽然台湾地区工研院经资中心预估,2003年全球半导体市场可望有11%
Semiconductor technology continues to improve, IC design industry but suffer from not enough market size to support product development costs. According to the IC design industry, in the 0.35-micron manufacturing process, new product development costs only about $ 1 million; as long as the market reaches $ 10 million, it will be enough. However, as the semiconductor manufacturing process enters the 12-inch substrate, 0.13-micron era, development costs have been underpinned by the $ 100 million market for new products as manufacturing costs have soared. How easy is it to create a revenue of 100 million U.S. dollars for new products while new applications are not enough to generate huge demand (star products only happen occasionally) Center estimates that in 2003 the global semiconductor market is expected to have 11%