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研究了Sn-3.5Ag-0.75Cu和Sn-0.75Cu焊料合金在NaCl-Na_2SO_4-Na_2CO_3模拟土壤溶液中的腐蚀浸出行为,并与Sn-37Pb焊料合金的腐蚀浸出行为对比分析。研究表明,这3种焊料合金中Sn的浸出量随时间的延长趋于平缓,且Sn-0.75Cu焊料合金中Sn的浸出量最高,添加Ag元素后明显抑制了Sn-3·5Ag-0·75Cu焊料合金中Sn的浸出;Ag,Cu,Pb的浸出量随时间的延长呈线性增加,且Ag,Cu的浸出量较少。3种焊料合金浸出后表面产物层较厚,主要由Sn_4(OH)_6Cl_2和SnO组成,其中Sn-0.75Cu焊料合金的表面产物层有裂纹和孔洞,Sn-3.5Ag-0.75Cu焊料合金的表面产物相对致密,而Sn-37Pb焊料合金的表面产物局部出现剥落现象。这3种焊料合金浸出动力学行为存在差异,主要与表面产物的相组成和形貌有关。
The corrosion and leaching behaviors of Sn-3.5Ag-0.75Cu and Sn-0.75Cu solder alloys in NaCl-Na_2SO_4-Na_2CO_3 simulated soil solution were studied and compared with those of Sn-37Pb solder alloy. The results show that the leaching amount of Sn in these three kinds of solder alloys tends to be gentle with time, and Sn-0.75Cu solder alloy has the highest amount of Sn leaching. The addition of Ag significantly suppresses the Sn-3 · 5Ag-0 · 75Cu solder alloy leaching of Sn; Ag, Cu, Pb leaching amount increased linearly with the extension of time, and the leaching of Ag, Cu less. The three kinds of solder alloy leaching thicker surface product layer, mainly by Sn_4 (OH) _6Cl_2 and SnO composition, which Sn-0.75Cu solder alloy surface product layer cracks and holes, Sn-3.5Ag-0.75Cu solder alloy surface The product is relatively dense, while the surface product of Sn-37Pb solder alloy spalling occurs locally. The kinetic behavior of the three solder alloys leaching is different, mainly related to the phase composition and morphology of the surface product.