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用开路电位法、极化曲线法和电化学阻抗技术研究硫酸盐还原菌(SRB)对铜镍锡合金腐蚀行为的影响。用扫描电镜(SEM)和能谱分析(EDS)观察铜镍锡合金的腐蚀形貌。结果表明,SRB的存在使电极开路电位从-275mV负移至-750mV,较无菌环境中开路电位(-100mV)下降了650mV,合金腐蚀加速。扫描电镜观察结果表明,合金表面生成不均匀的生物膜,主要发生点蚀和缝隙腐蚀。能谱分析显示腐蚀产物主要是铜和镍的硫化物,生物膜下铜镍锡合金发生脱镍和脱锡腐蚀。
The effects of sulfate reducing bacteria (SRB) on the corrosion behavior of copper, nickel and tin alloy were studied by open circuit potential method, polarization curve method and electrochemical impedance spectroscopy. The corrosion morphology of copper-nickel-tin alloy was observed by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). The results showed that the existence of SRB negatively shifted the open circuit potential from -275mV to -750mV, which was 650mV lower than the open circuit potential (-100mV) in sterile environment. The corrosion of the alloy accelerated. Scanning electron microscopy results show that the surface of the alloy generated uneven biofilm, the main occurrence of pitting and crevice corrosion. EDS analysis showed that the corrosion products were mainly copper and nickel sulfide, and the biofilm copper nickel-tin alloy de-nickel and tin-off corrosion.