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以点焊代铆接应用于结构件生产,可以大大地提高工效,缩短周期,节约成本,也使点焊工艺进入了一个新阶段。在点焊过程中,诸如裂纹、缩孔、飞溅等缺陷,用X光摄影法能十分可靠地检查出来,但是,对于另一个危险的缺陷——未焊透(特别是完全未焊透——又称“脱点”)却没有一种可靠的检验方法。国外曾经利用“暗环”这一特征来判别是否未焊透,他们认为“焊透的焊点都有富铝层,而富铝层在X光底片上显现为暗环。故凡有暗环的点,均为焊透,而没有暗环的点均为未焊透”。然而,我们根据大量焊点的分析,表明这种方法并不可靠,特别是对于Л1+1毫米的薄板点焊件,每一优良焊点并非都有暗环,而有时出现了暗环反而是“脱点”。
To spot welding riveting used in the production of structural parts, can greatly improve work efficiency, shorten the cycle, cost savings, but also to spot welding technology has entered a new phase. During spot welding, defects such as cracks, shrinkage, splashing and the like can be very reliably detected by X-ray photography, but for another dangerous defect - incomplete penetration (in particular incomplete penetration - Also known as “off point ”) But there is no reliable test method. Foreign countries have used “dark ring ” this feature to determine whether the penetration is not, they think “penetration of the solder joints have aluminum-rich layer, and the aluminum-rich layer appears on the X-ray film dark ring. A dark ring point, are penetration, and no dark ring points are not penetration ”. However, based on the analysis of a large number of solder joints, this method is not reliable. Especially for the thin plate spot-welded parts of Л1 + 1 mm, each excellent solder joint does not have a dark ring, and sometimes the dark ring is instead “Off point ”.