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本文采用动态介电分析技术对不同分子量的环氧树脂进行了固化过程中介电谱的研究,通过对不同分子量的环氧树脂在固化过程中电容和介电损耗角正切的测量得出,分子量不同导致软化温度、凝胶温度和凝胶时间不同,树脂固化时加压时间也不同。本文还选择了53~#环氧树脂的预固化温度,可根据不同的预固化温度、选择加压时机。
In this paper, the dynamic dielectric analysis of different molecular weight of epoxy resin curing process of dielectric spectra through the different molecular weight of epoxy resin in the curing process of capacitance and dielectric loss tangent measurements obtained molecular weight difference Leading to softening temperature, gel temperature and gel time are different, the curing time when the resin pressure is also different. This article also chose 53 ~ # epoxy pre-curing temperature, according to the different pre-curing temperature, select the timing of the pressure.