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本文概述了激光增强电镀的原理,介绍了用来研究电镀铜激光增强效应的实验装置和方法。电镀实验用CuSO_4水溶液为电解液,用镍薄膜作为阴极、铂片为阳极,极间施加直流电压。当用经过聚焦的氮离子激光束照射阴极时,观察到激光诱发的电镀增强效应。测量表明:激光增强的电镀电流要比无激光照射的背景电镀电流大10~3倍。用激光增强电镀方法成功地镀得了直径(或宽度)为几十微米的金属铜点(和线),镀层厚度为1-2微米,金属铜的沉积速率为1微米/秒,亦比背景沉积速率(10~(-3)微米/秒)大三个数量级。文中还给出当工作条件改变时电镀参数(电镀电流变化量、增强比和镀点直径)的变化规律。
This paper presents an overview of the principle of laser enhanced plating, and introduces the experimental setup and method for studying the enhanced effects of copper electroplating. Electroplating experiments with CuSO4 aqueous solution as the electrolyte, with nickel film as the cathode, platinum anode, between the applied DC voltage. When the cathode was irradiated with a focused nitrogen ion laser beam, a laser-induced plating enhancement effect was observed. Measurements show that laser-enhanced plating current is 10 to 3 times larger than background plating current without laser irradiation. Metallic copper dots (and lines) of several tens of microns in diameter (or width) were successfully plated by laser-enhanced electroplating with a coating thickness of 1-2 microns and a deposition rate of metallic copper of 1 microns / second compared to background deposition Rate (10 ~ (-3) microns / second) three orders of magnitude. The article also gives the law of variation of electroplating parameters (electroplating current variation, enhancement ratio and plating point diameter) when working conditions change.