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本文应用正电子湮没技术、X—射线衍射技术和光学显微术研究了电沉积镍结构与内应力和显微硬度的关系。实验表明,在镍镀液中加入糖精可以改变镍镀层晶体的生长模式、织构和内应力状态。镀层在退火处理后,其显微硬度的变化与正电子湮没平均寿命τ的变化有明显的对应关系,这是镀层的机械性能取决于内部结构的明显例证。实验还表明电沉积镍在退火时发生了再结晶作用,说明它是一种介稳态结构,其内部蕴含着诱发再结晶的过剩能量,特别是与基体交界处的能量较高,再结晶最先从这里发生。
In this paper, positron annihilation, X-ray diffraction and optical microscopy were used to study the relationship between nickel electrodeposition and internal stress and microhardness. Experiments show that the addition of saccharin in the nickel plating solution can change the crystal growth mode, texture and internal stress state of the nickel coating. After annealing, the change of microhardness of the coating has a clear correspondence with the change of positron annihilation mean life τ, which is a clear example of the mechanical properties of the coating depending on the internal structure. Experiments also show that the nickel electrode during recrystallization recrystallization, indicating that it is a metastable structure, which contains the internal energy induced recrystallization excess energy, especially with the junction of the higher energy, the most recrystallization First from here.