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开发背景 大约在15年前,日本disco公司开始研制广泛应用于半导体硅片分划和切割的划片锯,国内俗称砂轮划片机或简称为划片机。目前,该公司已有五种型号的划片机推向市场,该公司生产的各种划片机约占日本国内市场总需量的70％,1985年度划片机销售总额达56亿日元,合人民币1.5亿余元。五种型号的划片机中包括DAD—2H、DAD—2H/5和DAD—2
Development background About 15 years ago, Japan disco company began to develop a wide range of applications in the division and cutting of semiconductor wafers dicing saws, commonly known as the domestic Dicing Scriber or simply scribing machine. Currently, the company has put five types of scribing machines on the market. The company produces a variety of scribing machines that account for about 70% of the total domestic market demand in Japan. Scriber sales in 1985 totaled 5.6 billion yen , Together 150 million yuan. Five models of dicing saw include DAD-2H, DAD-2H / 5 and DAD-2