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受中国电子器件总公司委托,北京电子学会半导体封装分会同美国微电子封装公司于1985年12月18～19日在北京举办了黑陶瓷低温玻璃封装技术座谈会.美国微电子封装公司付总裁周莫声先生首先介绍了美国半导体封装概况.在座谈会上,周先生对黑陶瓷低温玻璃封
Commissioned by China National Electronics Corporation, Beijing Institute of Electronics Semiconductor Packaging Branch and the United States microelectronics packaging company in December 18-19, 1985 in Beijing held a black ceramic low temperature glass packaging technology forum.Microsoft Microelectronics Packaging Company President Week Mr. Mo Sheng first introduced the overview of the semiconductor package in the United States at the forum, Mr. Zhou of black ceramic low temperature glass seal