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采用透射电子显微镜及三维原子探针观察及统计分析研究了0.3%(质量分数)Sc添加对Al-2.5%Cu合金时效析出行为的影响,采用电化学分析方法对比了Sc添加前后合金的电化学腐蚀行为,藉此建立了时效析出第二相与电化学腐蚀性能之间的关联并阐明了Sc的微合金化作用。研究结果表明:Sc的加入显著影响了Al-Cu合金中θ’-Al2Cu的析出,使得析出相密度增加尺寸减小,同时由于Sc原子在析出相/基体界面的偏聚降低了界面能,从而影响了合金的电化学腐蚀行为,使得含Sc合金的耐蚀性明显优于纯Al-Cu合金。结果可以为耐腐蚀、高性能Al-Cu合金的微合金化材料设计提供参考。
The effects of 0.3% (mass fraction) Sc addition on the aging precipitation behavior of Al-2.5% Cu alloy were investigated by transmission electron microscopy, three-dimensional atomic probe observation and statistical analysis. The electrochemical behavior of the alloy before and after Sc addition was compared by electrochemical analysis Corrosion behavior, thereby establishing the correlation between the precipitated second phase and electrochemical corrosion performance and clarify the micro-alloying effect of Sc. The results show that the addition of Sc significantly affects the precipitation of θ’-Al2Cu in the Al-Cu alloy, resulting in an increase in the size of the precipitated phase. At the same time, the segregation of Sc atoms at the precipitated phase / matrix interface lowers the interfacial energy Affecting the electrochemical corrosion behavior of the alloy, making the corrosion resistance of the alloy containing Sc significantly better than the pure Al-Cu alloy. The results provide a reference for the design of microalloyed materials for corrosion-resistant and high-performance Al-Cu alloys.