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以酚醛摩尔比1∶1.7,氧化降解木质素40%替代苯酚制备可发性甲阶酚醛树脂,采用DSC研究其等温条件不同温度下的固化动力学,并运用哈克流变仪研究该树脂的固化活性。结果表明,不同温度下树脂的固化反应焓变基本相同,随着固化温度的升高,固化速率得到较大提高;木质素改性可发性甲阶酚醛树脂的固化动力学方程:dα/dt=2.83×1017×exp(-125.27×103/RT)(1-α)0.84。由该方程模拟的等温聚合反应程度与时间的关系曲线与实际情况基本吻合。
The resol-induced phenolic resin was prepared by the phenol-formaldehyde molar ratio of 1: 1.7 and the oxidative degradation of phenol by 40% instead of phenol. The DSC and DSC were used to study the curing kinetics of isoprene at different temperatures. Curing activity. The results showed that the enthalpy change of resin curing reaction was basically the same under different temperatures, and the curing rate was greatly increased with the increase of curing temperature. The curing kinetics equation of the resin could be as follows: dα / dt = 2.83 × 1017 × exp (-125.27 × 103 / RT) (1-α) 0.84. The curve of the relationship between the degree of isothermal polymerization and the time simulated by the equation is in good agreement with the actual situation.