论文部分内容阅读
written by Wang Yi， President of Chinese micro-nano technology club
Smartphone sensor microstructure， biomedical gene sequencing chip， nanocell 3D printing of beauty， smart dust， nano/ pico type satellite… super dreams that only appeared in science fiction movies in the past have been coming true via means of MEMS technology. MEMS is deservedly known as the“Pearl” of micro-nano manufacturing technology！
What is MEMS？
The full name of MEMS is Micro-Electro-Mechanical Systems， micro system in Europe， and micro machine in Japan.
MEMS is a special semiconductor device that can achieve mechanical， mechanics， and other functions， including two categories of sensors and actuators. MEMS focuses on a number of today's cutting-edge achievements of science and technology development， involving a variety of disciplines and engineering technology， with advantages of small size， light weight， low power consumption， low cost， high integration， and have a broad prospect in the consumer electronics， automotive electronics ， industrial control， health care， aerospace and military defense， etc.
3 Advantages
Miniaturization
The length of a typical MEMS device is about 1 micron to 1 cm. Of course， the size of the array of MEMS devices or MEMS entire system will be even greater. Small size enables flexible support， bringing high resonance frequency， low thermal inertia and other advantages. For example， the heat transfer rate of the micro-machined device is usually faster.
ce the size of traditional MEMS post. These devices and systems are referred NEMS. Many NEMS devices are assembled using nanostructures prepared， such as nanotubes. In some applications. NEMS provide the performance characteristics that MEMS do not have， such as able to achieve MHz （GHz） range of ultra-high mechanical resonance frequency， etc.
Integrated
Microelectronics
Another highlight of MEMS is that the sensors and actuators and mechanical components processing and control circuit simultaneously are integrated on a single chip. This integrated form mainly relies on monolithic integration， that is， the application of the whole piece of the substrate processing process， integrating different components on a single substrate method； not including pickup machine or manual assembling hybrid assembly methods. Monolithic integration is of higher technical requirements and lithography technology can ensure accurate device size and position of the element. High-precision
volume manufacturing
MEMS technology is the general call of micro-structure processing technology from the nanometer scale to the millimeter scale. The technology originated in the microelectronics and semiconductor technology， having lithography， epitaxy， deposition， oxidation， diffusion， implantation， sputtering， evaporation， etching and other steps as the basic process for the manufacture， to make complex and highly accurate two-dimensional and three-dimensional structure， such as the inverted pyramid-shaped cavities， high aspect ratio trench， silicon vias， Izod and films. The conventional machining techniques can not process these micro structures with repetition， high efficiency， and low cost.
Today， in the international community， fields represented by the iPhone smart phones， smart wearable devices， intelligent home， driverless cars， bio-medical， aerospace and other fields， have had extensive use of a variety of MEMS devices. More and more new things MEMS market is also pushing a new round of explosive growth.
Smartphone sensor microstructure， biomedical gene sequencing chip， nanocell 3D printing of beauty， smart dust， nano/ pico type satellite… super dreams that only appeared in science fiction movies in the past have been coming true via means of MEMS technology. MEMS is deservedly known as the“Pearl” of micro-nano manufacturing technology！
What is MEMS？
The full name of MEMS is Micro-Electro-Mechanical Systems， micro system in Europe， and micro machine in Japan.
MEMS is a special semiconductor device that can achieve mechanical， mechanics， and other functions， including two categories of sensors and actuators. MEMS focuses on a number of today's cutting-edge achievements of science and technology development， involving a variety of disciplines and engineering technology， with advantages of small size， light weight， low power consumption， low cost， high integration， and have a broad prospect in the consumer electronics， automotive electronics ， industrial control， health care， aerospace and military defense， etc.
3 Advantages
Miniaturization
The length of a typical MEMS device is about 1 micron to 1 cm. Of course， the size of the array of MEMS devices or MEMS entire system will be even greater. Small size enables flexible support， bringing high resonance frequency， low thermal inertia and other advantages. For example， the heat transfer rate of the micro-machined device is usually faster.
ce the size of traditional MEMS post. These devices and systems are referred NEMS. Many NEMS devices are assembled using nanostructures prepared， such as nanotubes. In some applications. NEMS provide the performance characteristics that MEMS do not have， such as able to achieve MHz （GHz） range of ultra-high mechanical resonance frequency， etc.
Integrated
Microelectronics
Another highlight of MEMS is that the sensors and actuators and mechanical components processing and control circuit simultaneously are integrated on a single chip. This integrated form mainly relies on monolithic integration， that is， the application of the whole piece of the substrate processing process， integrating different components on a single substrate method； not including pickup machine or manual assembling hybrid assembly methods. Monolithic integration is of higher technical requirements and lithography technology can ensure accurate device size and position of the element. High-precision
volume manufacturing
MEMS technology is the general call of micro-structure processing technology from the nanometer scale to the millimeter scale. The technology originated in the microelectronics and semiconductor technology， having lithography， epitaxy， deposition， oxidation， diffusion， implantation， sputtering， evaporation， etching and other steps as the basic process for the manufacture， to make complex and highly accurate two-dimensional and three-dimensional structure， such as the inverted pyramid-shaped cavities， high aspect ratio trench， silicon vias， Izod and films. The conventional machining techniques can not process these micro structures with repetition， high efficiency， and low cost.
Today， in the international community， fields represented by the iPhone smart phones， smart wearable devices， intelligent home， driverless cars， bio-medical， aerospace and other fields， have had extensive use of a variety of MEMS devices. More and more new things MEMS market is also pushing a new round of explosive growth.