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为了改善扭转微镜的机电耦合特性和光学特性,提出了一种新的基于SOI硅片的垂直扭转梳齿静电驱动结构．通过有限元与边界元方法,对不同厚度扭转梁的机电耦合特性进行了数值模拟,得到了相应的阈值电压和吸合电压,并提出了几种新的折叠梁结构,以进一步改善器件的机电耦合特性;通过力学分析,从理论上推导了垂直扭转梳齿静电驱动方式微镜的最大扭转角度、阈值电压、扭转刚度以及固有频率,获得了结构参数对器件机电耦合特性的影响机制;最后,利用比例散射理论讨论了表面粗糙度、入射光束波长和入射角度等参数对微镜表面光学反射性能的影响,并利用原子力显微镜测量了微镜的表面粗糙度．理论模拟与实验研究表明,基于SOI硅片和垂直扭转梳齿结构的硅微机械扭转微镜可显著降低器件的驱动电压,提高器件的机电耦合特性和微镜表面的光学反射特性．
In order to improve the electromechanical coupling characteristics and optical properties of the torsion micromirror, a novel vertical twisted comb-tooth electrostatic driving structure based on SOI wafers was proposed. Through the finite element and boundary element method, the electromechanical coupling characteristics of torsion beam with different thickness were numerically simulated, and the corresponding threshold voltage and pull-in voltage were obtained. Several new folded beam structures were proposed to further improve the mechanical and electrical performance of the device The torsional stiffness, torsional stiffness and natural frequency of the micromirrors in vertical twisted comb-type electrostatic driving micromirrors are deduced theoretically by mechanics analysis. Finally, the influence of structural parameters on the electromechanical coupling characteristics of the device is obtained. Finally, The effects of surface roughness, incident beam wavelength and incident angle on the optical reflectivity of micromirrors were discussed by means of proportional scattering theory. The surface roughness of micromirrors was measured by atomic force microscopy. Theoretical simulations and experimental studies show that silicon micromechanical twisting micromirrors based on SOI wafers and vertical twisted comb structures can significantly reduce the driving voltage of the device and improve the electromechanical coupling characteristics and the optical reflection characteristics of the micromirror surface.