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一、前言晶体管、集成电路等半导体器件组装方式有两种:一种是不用金属丝的电路转换法(CCB法)和带式载流法等;另一种是用金属丝的引线接合法。由于引线接合法所用的丝材品种易于改变,生产效率高,技术成熟等,所以正在成为晶体管,集成电路和大规模集成电路组装中的主流.目前最广泛使用的金属引线是Au丝和Al丝. 半导体器件封装方法的不同,所使用的金属引线也不一样.树脂封装时用Au丝,陶瓷封装时用Al丝(见表1).
I. INTRODUCTION Transistor, IC and other semiconductor devices are assembled in two ways: one is a circuit conversion method without wires (CCB method) and a band-type current-carrying method, and the other is wire bonding method using a metal wire. Wire leads are becoming the mainstream in the assembly of transistors, integrated circuits and large scale integrated circuits due to the easy change of wire types used in the wire bonding method, high production efficiency, mature technology, etc. Currently, the most widely used metal wire is Au wire and Al wire Different semiconductor device packaging methods, the use of metal leads are not the same. Resin package with Au wire, ceramic package with Al wire (see Table 1).