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无引线片状元件作为提高集成度的一种方法得到了广泛的应用。首先要用粘结剂把片状元件定位在印制板上,而后再靠波峰焊使之金属化的端部与印制线路固接。为控制快粘胶的用量并使元件按正确位置定位、定向,现已研制出高精度的吸——放机构。在印制电路板的焊接面上,装有片状元件的印制电路板组件的波峰焊存在一些独特的问题。两个最普遍的问题是:不浸润(可焊性差)和漏焊(不形成焊点)。
Leadless chip components as a way to improve the degree of integration has been widely used. First of all, to use adhesive to locate the chip components printed on the board, and then by wave soldering the end of the metal and printed lines fixed. To control the amount of fast viscose and components according to the correct location, orientation, has developed a high-precision suction - release agencies. Wave soldering of printed circuit board assemblies with chip components on the soldered side of a printed circuit board presents some unique problems. The two most common problems are: non-wetting (bad solderability) and missing solder (no solder joints formed).