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利用扫描电镜、透射电镜、聚焦离子束、强度测试仪研究了键合Cu线无卤直接镀Pd工艺及镀Pd键合Cu线性能,分析了热处理温度对直接镀Pd键合Cu线钯层界面结合强度、镀Pd键合Cu线拉断力、伸长率及钯层厚度的影响。结果表明:无卤直接镀Pd工艺可获得镀层均匀的镀Pd键合Cu线;随热处理温度增加,钯层结合强度增加,热处理温度300℃时,镀层与基体结合强度较低;热处理温度450℃时,直接镀Pd键合Cu线钯层与基体Cu之间产生了Pd3Cu5金属间化合物,钯层与铜线基体结合强度较好;热处理温度450℃时,直接镀钯铜线具有优良的力学性能适当的钯层厚度,镀Pd键合Cu线拉断力为0.096 N,伸长率为14.3%,钯层厚度为78 nm;热处理温度500℃时镀Pd键合Cu线晶粒粗大,力学性能降低,拉断力为0.073 N,伸长率为11.6%。
The properties of Pd-bonded Pd wire and Pd-bonded Cu wire were investigated by scanning electron microscopy, transmission electron microscopy, focused ion beam and intensity tester. The effects of heat treatment temperature on the Pd-Pd interface Cu layer palladium interface Bond strength, tensile bond breaking force, elongation and palladium layer thickness of Pd-bonded Cu wire. The results show that the Pd-free Cu-plated Cu wire can be obtained by the Pd-free direct Pd plating process. The bonding strength of the Pd layer increases with the increase of the heat treatment temperature. When the heat treatment temperature is 300 ℃, the bonding strength between the coating and the substrate is low. , The Pd3Cu5 intermetallic compound was formed between the Pd-Cu-Pd-Pd layer and the Cu substrate directly, and the bonding strength between the Pd-Cu layer and the Cu-Cu substrate was better. When the thermal treatment temperature was 450 ℃, the Pd- Appropriate thickness of Pd layer, the breaking force of Cu wire coated with Pd bond was 0.096 N, the elongation rate was 14.3%, the thickness of palladium layer was 78 nm. The Pd-bonded Cu wire with coarse grain size and mechanical properties Reduced, breaking force of 0.073 N, elongation of 11.6%.