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在硅酸钠和含氟添加剂组成的电解液体系中,采用微弧氧化的方法在工业纯铝及其氩弧焊接接头表面均匀生长了一层陶瓷膜。利用扫描电镜、能谱仪和X射线衍射仪分析了铝基体和焊接区表面陶瓷膜的形貌和相组成;探讨了硅酸钠的浓度对陶瓷膜厚度及粗糙度的影响。结果表明:铝基体及焊接区陶瓷膜的厚度及粗糙度均随着硅酸钠浓度的增大而增加,焊区膜厚及粗糙度小于基体金属。铝基体和焊缝区的微弧氧化膜特性几乎相同,陶瓷膜都是由α-Al2O3、γ-Al2O3组成。和基体金属相比,焊区陶瓷膜对应的气孔小些,且相对光滑、均匀。
In the system of electrolyte composed of sodium silicate and fluorine-containing additive, a layer of ceramic film is uniformly grown on the surface of industrial pure aluminum and its argon arc welding joint by the micro-arc oxidation method. The morphology and phase composition of the ceramic film on the surface of the aluminum substrate and the soldering zone were analyzed by scanning electron microscopy, energy dispersive spectroscopy and X-ray diffraction. The effects of sodium silicate concentration on the thickness and roughness of the ceramic film were also discussed. The results show that the thickness and roughness of the ceramic film in the aluminum substrate and the soldering area both increase with the increase of the concentration of sodium silicate, and the film thickness and roughness of the solder pad are smaller than those of the base metal. The properties of MAO coatings on the aluminum substrate and the weld zone are almost the same. The ceramic coatings are composed of α-Al2O3 and γ-Al2O3. Compared with the base metal, the porosities of the ceramic zone of the soldering zone are smaller and relatively smooth and uniform.