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椭偏光测厚仪是一种根据物理光学原理测量薄膜厚度和折射率的仪器。它的特点是能测很薄的膜(可达10埃)测量精度很高(误差小于±10埃),测量过程对样品无损坏,并且能同时测定膜的厚度和折射率。 国外,近十多年来,椭偏光法有了不少进展。近几年来,我国也开展了这方面的工作。1975年北京成立会战组,根据我国情况,自力更生,自行设计和试制了TP75型椭偏光测厚仪。接着,我们将该设备应用于硅集成电路的研制过程中,测量了氧化硅、氮化硅、氧化铝、光刻胶等多种薄膜的厚度和折射率,用它协助选择氮化硅淀积工艺条件。用它研究光刻胶的涂敷和刻蚀条件及针孔情况,用它配合测定离子注入后的杂质分布等等,收到了良好的效果。
Ellipsometric thickness gauge is an instrument that measures the film thickness and refractive index based on the principle of physical optics. It features a very thin film (up to 10 angstroms) with high accuracy (less than ± 10 angstroms), no damage to the sample during measurement, and the ability to simultaneously measure the film thickness and refractive index. Abroad, the past ten years, the ellipsometry has made a lot of progress. In recent years, our country has also carried out this work. In 1975, Beijing set up a conference group to design and manufacture the TP75-type ellipsometric thickness gauge independently according to our own conditions. Next, we used the device in the development of silicon integrated circuits. We measured the thickness and refractive index of various thin films of silicon oxide, silicon nitride, aluminum oxide, photoresist and the like, and used it to help select the silicon nitride deposition Process conditions. Use it to study the photoresist coating and etching conditions and pinhole situation, with it with the determination of ion implantation impurity distribution, etc., received good results.