Interracial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni（P） deposited on SiCp/A1 comp

• 作 者: 吴茂 曲选辉 何新波 Raft—ud—din 任淑彬 秦明礼
• 机 构: StateKeyLaboratoryforAdvancedMetalsandMaterials
• 出 处: 中国有色金属学报：英文版
• 发表日期: 2010年6期
• 关键词: 无电镀镍 复合材料 锡焊料 Sn 焊接接头 沉积 反应 种族 SnAgNi solder electroless Ni（P） SiCp/Al composi
• 基金项目: Projects（50274014, 50774005） supported by the National Natural Science Foundation of China, Project（2006CB605207） supported by theNational Basic Research Program of China, Project（2006A.A03Z557） suppo

A novel Sn-2.5Ag-2.0Ni alloy was used for soldering SiCp/Al composites substrate deposited with electroless Ni(5%P) (mass fraction)and Ni(10%P)(mass fraction)layers.It is observed that variation of P contents in the electroless Ni(P)layer results in diffe