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导电胶粘剂在电子工业生产中已得到广泛的应用。但目前国内所使用的导电胶都以银粉作为导电填料。银粉为填料的导电胶导电性能优异,化学稳定性强,有较好的耐久性。但此种导电胶有一个致命的问题——就是存在“银迁移”现象,即如文献指出的“在电压差加高潮湿度的一定条件下”,银将跨过介质材料,“迁移”形成导电线路短路,造成导电连接失败。另外银粉价格昂贵,使胶的成本增高。国内外对此进行了广泛的研究,提出了许多的专利和方法。如研
Conductive adhesives in the electronics industry has been widely used. However, the conductive paste used in China uses silver powder as the conductive filler. Silver conductive filler for the filler conductive properties, chemical stability, better durability. However, this kind of conductive adhesive has a fatal problem - that is, there is a phenomenon of “silver migration”. That is, as pointed out in the literature, under certain conditions of voltage difference plus high humidity, silver will cross the dielectric material and “migrate” The line is short-circuited, causing the conductive connection to fail. In addition silver price is expensive, so that the cost of plastic increased. At home and abroad conducted extensive research on this, put forward many patents and methods. Such as research