论文部分内容阅读
一、前言电子元器件引线可焊性是当前电子行业十分关注的质量问题。提高引线可焊性,并能在相当长(1～2年)的存贮期后,仍能保持高速度成批焊接到印刷电路板上的可靠性,就需要引线具有瞬间锡焊性能,这是元器件厂和引线材料生产厂正在研究解决的一个重要课题。在不断实践的基础上,我们经过三年多的试验和努力,在改进引线镀层质量,提高可焊性的前提下,围绕着镀层厚度和均匀方面,由热镀复过渡到电镀工艺。在镀层材料选择方面,由纯锡改进为锡铅合金。本文就阻容元件引线光亮连续电镀SnPb工艺及其对可焊性的影响,做了各种试验、分析和测试,从而确立了电镀新工艺,实现了这一生产技术革新改造,为提高引线可焊性创立了条件。
First, the preface Solderability of electronic components lead is the current electronic industry is very concerned about the quality of the problem. Improved lead solderability and the ability to maintain high-speed solder-to-PCB reliability over a relatively long (1-2 year) storage period require leads with instant solderability, which Is a component factory and lead materials factory is studying and solving an important issue. On the basis of constant practice, after more than three years of trial and hard work, we improve the quality of the lead plating and improve the solderability. The transition from the hot plating to the plating is carried out around the thickness and uniformity of the coating. In the selection of coating materials, from pure tin to tin-lead alloy. In this paper, the resistance of the capacitive element lead bright continuous plating SnPb process and its impact on the solderability, a variety of tests, analysis and testing, thus establishing a new electroplating process, to achieve this innovation in production technology, to improve the lead Solderability created conditions.