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随着半导体器件在电子仪器和各种家用电器上的广泛应用,印制电路板作为安装元件、联接布线的基板,其产量亦与日俱增。目前,对印制板的照相腐蚀、丝网漏印和滚锡等工艺,国内已有较先进的生产设备,形成了大量的生产能力。但对印制板上插元件引线的许多小孔的加工‘尚无满意的工艺方法。这些小孔的特点是:
With the widespread use of semiconductor devices in electronic devices and various home appliances, the production volume of printed circuit boards as mounting components and connecting wiring substrates has also increased. At present, the printing plate corrosion, screen leakage and rolling tin and other technology, the country already has more advanced production equipment, the formation of a large number of production capacity. However, there is not a satisfactory process for the processing of many small holes in the leads of printed boards. The characteristics of these holes are: