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一、前言铜合金多级抛光是一种新型的工艺,一般使用酸性过氧化氢体系。最早的文献见于六四年的三级化学抛光工艺,其过程为:第一级用盐酸和过氧化氢溶液处理铜件,使其表面形成保护膜;第二级用过氧化氢溶液氧化保护膜;第三级则用硝酸溶解这层膜而得到光亮的表面。我们研究了铜合金两级化学抛光工艺,实践表明:用该工艺处理后的铜合金表面可达镜面光泽,甚至在高倍显微镜下可直接观察其金相组织,经钝化后,其工艺表面具有优良的抗蚀性能。二、操作过程及工艺规范
First, the preface Copper alloy multi-level polishing is a new type of process, the general use of acidic hydrogen peroxide system. The earliest documents seen in 64 chemical polishing process, the process is: the first level with hydrochloric acid and hydrogen peroxide solution treatment of copper, the surface to form a protective film; the second level with hydrogen peroxide solution to protect the film ; The third level is nitric acid dissolved in this film and get a shiny surface. We studied copper alloy two-stage chemical polishing process, the practice shows that: the surface of the copper alloy treated with the process up to the specular gloss, and even under high magnification microscope can directly observe the microstructure, after passivation, the surface of the process has Excellent corrosion resistance. Second, the operation process and process specifications