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采用静滴法研究了493～623K范围内,Sn-30Bi-0.5Cu合金熔体在Cu基板上的铺展动力学.在Ar-H2流动气氛中,采用高像素数码摄像机实时在线记录了Sn-30Bi-0.5Cu合金熔体在Cu基板上的铺展过程中,其铺展前沿(即熔滴的基底半径)随时间变化情况.结果表明,在温度范围493～523K内,铺展过程中的ln(dR/dt)与lnR的关系较好地符合De Gennes铺展模型关系式,而在温度范围548～623K内,实验结果与De Gennes铺展模型关系式表现出明显偏差.从结果来看,温度对于Sn-30Bi-0.5Cu/Cu体系的铺展机理有着复杂的影响.Sn-30Bi-0.5Cu/Cu之间生成的金属间化合物的成分经电子探针微区分析(EPMA)确认为Cu6Sn5和Cu3Sn,该金属间化合物在气液固三相界面处位于铺展的前沿,其生成有利于铺展速率的提高.
The spreading kinetics of Sn-30Bi-0.5Cu melt on Cu substrate in the range of 493 ~ 623K was studied by using the drop-in-drop method.In the flowing atmosphere of Ar-H2, a high-resolution digital camera was used to record Sn-30Bi -0.5Cu alloy melts in the spreading process of Cu substrate, the spreading front (ie, the base radius of the droplet) changes with time.The results show that in the temperature range 493 ~ 523K, the spreading process ln (dR / dt and lnR are in good agreement with the De Gennes model, while the experimental results show a significant deviation from the De Gennes model in the temperature range of 548-623 K. From the results, the temperature dependence of Sn-30Bi -0.5Cu / Cu system.The complex of the intermetallic compounds formed between Sn-30Bi-0.5Cu / Cu was confirmed to be Cu6Sn5 and Cu3Sn by electron probe microanalysis (EPMA) The compound is at the front of the spreading at the gas-liquid-solid-three-phase interface, and its formation is beneficial to the increase of the spreading rate.