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应用嵌入原子势作为势函数,对薄膜沉积过程进行分子动力学模拟,来模拟不同工艺条件下的成膜过程、薄膜质量及各参数变化对成膜的影响.结果表明,衬底温度越高,则原子在薄膜表面的扩散能力越强,薄膜内部的空位密度越小.但衬底温度对薄膜质量的影响只在一定范围内比较明显;原子自身携带的能量越高,则其扩散能力也越强,特别是在衬底温度较低时,这项影响越大;随着原子入射角的增大,薄膜表面的纤维状生长及阴影响应越明显,薄膜的质量则明显下降.
Using the embedded atomic potential as the potential function, the film deposition process was simulated by molecular dynamics to simulate the filming process, the quality of the film and the changes of various parameters on the film formation under different process conditions.The results show that the higher the substrate temperature, The stronger the diffusion ability of atoms on the surface of the film is, the smaller the density of vacancies in the film is, but the influence of the substrate temperature on the film quality is only obvious within a certain range. The higher the atom’s own energy is, Especially when the temperature of the substrate is lower, the larger the effect is. With the increase of the incident angle of the atom, the fiber growth and shadow effect on the film surface are more obvious, and the quality of the film is obviously decreased.