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应用一个三层互连布线结构研究了诸多因素尤其是布线的几何构造对互连系统散热问题的影响,并对多种不同金属与介质相结合的互连布线的散热情况进行了详细模拟.研究表明互连线上焦耳热的主要散热途径为金属层内的金属线和介质层中热阻相对小的路径.因此互连系统的几何布线对系统散热具有重要影响.在相同条件下,铝布线系统的温升约为铜布线的ρAl/ρCu倍.此外,模拟了0·13μm工艺互连结构中连接功能块区域的信号线上的温升情况,探讨了几种用于改善热问题的散热金属条对互连布线的导热和附加电容的影响.
The influence of many factors, especially the geometry of the wiring, on the heat dissipation of the interconnected system is studied by using a three-layer interconnection wiring structure, and the heat dissipation of the interconnection wiring with various metals and dielectrics is simulated in detail. It is shown that the main heat dissipation path of Joule heat on the interconnection line is the relatively small thermal resistance of the metal lines in the metal layer and the dielectric layer. Therefore, the geometric layout of the interconnection system has an important influence on the heat dissipation of the system. Under the same conditions, The temperature rise of the system is about ρAl / ρCu times that of the copper wiring.Furthermore, the temperature rise on the signal lines connecting the functional blocks in the 0.13μm process interconnect structure is simulated, and several heat sinks Effect of metal strips on thermal conductivity and additional capacitance of interconnect wiring.