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通常中小功率塑封管的烧结方去有银泥、银浆、导电胶、共晶法等.前三种最大的特点是成本低效率高,但高低温热性能、电耐久性.工艺重复性差.共晶法技术难度较大,成本高,但质量和一致性好.为了保证彩电等整机的质量水平,目前国外采用此法颇多,在国内,对芯片来源于国外的部分厂家,也采用了此法.由于背面金属化等方面的原因,大部分国产化芯片,目前尚不能采用此法烧结.可是要求用于彩电的塑封管,必须全部采用共晶法烧结工艺.因此,尽快解决芯片背面金属化问题势在必行.
Usually small and medium-power plastic tube sintered to silver mud, silver paste, conductive plastic, eutectic method, etc. The first three most prominent feature is the cost of low efficiency, but high and low temperature thermal performance, electrical durability. Poor process repeatability. The eutectic method is more difficult and costly, but the quality and consistency is good. In order to ensure the quality level of color television sets and other machines, many foreign countries adopt this method. In China, some of the chips from foreign countries are also used This method .Because of the back of the metal and other reasons, most of the domestic chip, can not currently use this method of sintering. But for the plastic color TV tube, must be used in all eutectic sintering process.So as soon as possible to solve the chip The problem of the back of the metal is imperative.