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杜邦公司研制的生瓷带系统采用一种新的多层电路工艺,它的突出优点是低温、共烧。这种低温共烧工艺将厚膜系统的设计灵活性和共烧氧化铝系统制作方便的优点结合起来。它消除了传统厚膜工艺所需的多次烧
DuPont developed raw porcelain tape system uses a new multi-layer circuit technology, its outstanding advantage is low temperature, co-fired. This low temperature co-firing process combines the design flexibility of a thick-film system with the ease of fabrication of a co-fired alumina system. It eliminates the burns required for traditional thick-film processes