Model analysis and experimental investigation of the friction torque during the CMP process

• 作 者: 郭东明 徐驰 康仁科 金洙吉
• 机 构: Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education,Dalia
• 出 处: 半导体学报
• 发表日期: 2011年03期
• 关键词: torque friction polishing wafer endpoint verify calculating rotational Polish ki

A model for calculating friction torque during the chemical mechanical polishing(CMP) process is presented,and the friction force and torque detection experiments during the CMP process are carried out to verify the model.The results show that the model can well describe the feature of friction torque during CMP processing. The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle.

A model for calculating friction torque during the chemical mechanical polishing (CMP) process is presented, and the friction force and torque detection experiments during the CMP process are carried out to verify the model. The results show that the model can well describe the feature of friction torque during CMP processing. The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle.