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七、超高真空(一) 清洁真空的获得清洁真空与超高真空技术本章将要介绍清洁真空的获得问题,它与镀膜技术略有偏离。在超大规模集成电路制作中所要求的镀膜技术必然是生长清洁的薄膜,其不可缺少的条件是清洁真空的获得。清洁真空的获得离不开超高真空技术。清洁真空为什么是必要的?迄今为止,只是偶而提及,下面重新加以说明。无论是真空蒸发还是真空溅射,在基底上每平方厘米的面积上,每秒总有10~(15)个原子堆
Seven, ultra-high vacuum (a) of the vacuum to get a clean vacuum and ultra-high vacuum technology This chapter will introduce the issue of access to a clean vacuum, it is slightly deviated from the coating technology. The coating technology required in VLSI fabrication is necessarily a film that grows clean, an indispensable condition of which is the acquisition of a clean vacuum. Clean vacuum can not be achieved without ultra-high vacuum technology. Why is it necessary to clean the vacuum? So far, only occasionally mentioned, to re-explain below. Whether it is vacuum evaporation or vacuum sputtering, there are always 10 to 15 atomic stacks per second per square centimeter of area on the substrate