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在AMD以往的处理器芯片中,随着开发和生产工艺技术的不断改进,其产品的封装技术也在不断改进。目前,最新的处理器主要是采用OPGA封装方式。 1.OBGA封装方式 OBGA英文为“Organic Ball Grid Array”,中文意为“有机球栅格阵列”,属于早期普遍看好的BGA封装方式之一。从其名称可看出,这类封装采用锡球与处理器芯片插座电路进行联接,而非普通芯片中所采用的邦线,这种联接方式可更加有效地减少处理器芯片所占用空间,并且可以比传统邦线封装方式承受更多的芯片引脚数。
In the past, AMD processor chip, with the development and production technology continues to improve, its product packaging technology is also constantly improving. At present, the latest processor is mainly OPGA package. 1.OBGA package OBGA English as “Organic Ball Grid Array”, Chinese means “a ball grid array”, is generally one of the early optimistic about the BGA package. It can be seen from its name, this package uses solder balls and processor chip socket circuit to connect, rather than the common chip used in the state line, this connection can be more effective in reducing the processor chip space occupied, and Can withstand more pins than the traditional state line package.