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电子部基础产品发展研究中心及通信广播电视发展研究中心联合为日本TESCON公司举办了最新表面贴装技术讲座与现场演示。 该公司独自开发的高速贴片机,以0.3秒贴装1片元件的速度,实现了从焊膏丝网印刷到再流焊及图象处理检查的自动生产线,既可靠又高效,且最先在SMT设备上采用了汉化计算机系统,方便我国用户使用。几年来
Electronics Basic Products Development Research Center and Communications Broadcasting and Television Development Research Center jointly held the latest surface mount technology seminars and live demonstrations for Japan’s TESCON Corporation. The company’s independently developed high-speed placement machine, with a 0.3-second placement speed of one component, enables automated production lines from solder paste screen printing to reflow and image processing inspection, both reliable and efficient SMT equipment used in the finished computer system to facilitate the use of our users. Years ago