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集成电路芯片上各元件之间的互连接线,是经过蒸发以形成覆盖芯片表面氧化物的金属膜,再通过刻蚀形成的。对中小规模集成电路来说,由于元件少,连线简单,只需要单层布线。随着集成电路向大规模、高集成度和微细尺寸的发展,为避免集成电路中各元件间连线交叉重迭和迂回曲折,双层乃至多层金属布线便成为一项必不可少的工艺手段。由于采用多层布线技术,必然在集成电路表面形成金属连线和绝缘层的多层立体几何结构。若仍采用常规刻蚀工艺,势必由于表面凹凸不平使连线断裂或接触不良,导致电路失效。因此,如何制备平坦连续的表面,便成为双层布线的一个关
The interconnection between the components on the IC chip is evaporated by evaporation to form a metal film covering the oxide on the chip surface and then formed by etching. For small and medium-scale integrated circuits, due to fewer components, simple connection, only a single layer wiring. With the development of integrated circuits to large-scale, high integration and fine size, double and even multi-layer metal wiring has become an indispensable technology in order to avoid the overlapping and twisting of connections between components in an integrated circuit means. Due to the multi-layer wiring technology, it is inevitable to form a multi-layer three-dimensional geometric structure of the metal wiring and the insulating layer on the surface of the integrated circuit. If the conventional etching process is still used, it is bound to cause the circuit to fail due to the broken or poor connection due to the uneven surface. Therefore, how to prepare a flat and continuous surface, it becomes a double-layer wiring off