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镀铁工艺已有一百多的历史。过去,为了获得结合强度高的镀层,镀铁温度必须在100℃左右。而所得镀层较软,镀件使用前还要进行渗碳和淬火等一系列热处理,应用不便。但它有电流效率高、沉积速度快、镀层厚、成本低等优点。到本世纪六十年代,开始采用降低温度、以不对称交流电起镀,然后逐步过渡到直流电镀的新工艺,可以克服高温直流电镀铁的缺点。随着新工艺的不断改进和完善,又出现了用直流电小电流密度起镀,逐步过渡到正常电流密度镀铁工艺。这些新工艺的电解液温度低,人们就统称之为低温镀铁。
Iron plating process has more than 100 history. In the past, in order to obtain a coating with a high bonding strength, the temperature of the iron plating must be about 100 ° C. The resulting coating is relatively soft, before plating but also for carburizing and quenching and a series of heat treatment, application inconvenience. But it has the advantages of high current efficiency, fast deposition, thick coating, low cost and so on. By the sixties of this century, the new technology of lowering the temperature, starting the plating with asymmetric AC, and then gradually transitioning to DC plating can overcome the shortcomings of high-temperature DC iron plating. With the continuous improvement and improvement of the new technology, there has also been the use of DC current density from plating, and gradually transition to the normal current density of iron plating process. These new technology electrolyte temperature is low, people collectively referred to as low-temperature iron plating.