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利用磁控溅射技术在高速钢和单晶硅基体上沉积CrTiAlN梯度镀层,研究Ti靶电流对CrTiAlN镀层组织、相结构及硬度的影响。利用EDS、XRD和SEM分析镀层的成分、相结构及形貌,采用显微硬度计测量镀层的硬度。结果表明:随着Ti靶电流的增大,镀层中的Ti原子逐渐置换CrN中的Cr原子形成Cr-Ti-N体系,同时出现少量的TiN相;镀层生长的择优取向由(111)晶面逐渐转变为(200)晶面;镀层柱状晶的结构更为致密,其表面形貌由三棱锥结构逐步变为胞状结构;随Ti靶电流的增大,镀层硬度逐渐由1267HV升至1876HV。
The CrTiAlN gradient coating was deposited on high speed steel and monocrystalline Si substrate by magnetron sputtering. The effect of Ti target current on microstructure, phase structure and hardness of CrTiAlN coating was studied. The composition, phase structure and morphology of the coating were analyzed by EDS, XRD and SEM. The hardness of the coating was measured by microhardness tester. The results show that with the increase of Ti target current, the Ti atoms in the coating gradually displace the Cr atoms in the CrN to form the Cr-Ti-N system and a small amount of TiN phases appear. The preferred orientation of the growth of the coating is determined by the (111) Gradually transformed into (200) crystal plane. The structure of the columnar crystal was more dense and its surface morphology gradually changed from a triangular pyramid structure to a cellular structure. With the Ti target current increasing, the hardness of the coating gradually increased from 1267 to 1876 HV.