Effect of constraint on crack propagation behavior in BGA soldered joints

• 作 者: 王莉\\r\\r\\r\\r\\r\\r\\r\\r\\r\\n 王国忠\\r\\r\\r\\r\\r\\r\\r\\r\\r\\n 方洪渊\\r\\r\\r\\r\\r\\r\\r\\r\\r\\n 钱乙余
• 出 处: Transactions of Nonferrous Metals Society of China
• 发表日期: 2001年06期
• 关键词: joints constraint

The effects of stress triaxiality on crack propagation behavior in the BGA soldered joint were analyzed using FEM method. The computation results verified that stress triaxiality factor has an important effect on crack growth behavior. Crack growth rate increased with increasing stress triaxiality at the near tip region, which is caused by increasing crack lengths or decreasing solder joint heights. Solder joint deformation is subjected to constraint effect provided by its surrounding rigid ceramic substrate, the constraint can be scaled by stress triaxiality near crack tip region. Therefore, it can be concluded that crack growth rate increased when the constraint effect increases.

The effects of stress triaxiality on crack propagation behavior in the BGA soldered joint were analyzed using FEM method. The computation results verified that stress triaxiality factor has an important effect on crack growth behavior. Crack growth rate increased with increasing stress triaxiality at the near tip region , which is caused by increasing crack lengths or decreasing solder joint heights. Solder joint deformation is subjected to constraint effect provided by its surrounding rigid ceramic substrate, the constraint can be scaled by stress triaxiality near crack tip region. crack growth rate increased when the constraint effect increases.