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通过电导率测量、金相观察、扫描电镜分析等方法,研究了冷却速度和热处理工艺对铸造Al-9.8Si-2Cu合金微观组织和电性能的影响。结果表明:在不同浇注温度、铸模温度下,随着冷却速度的提高,凝固组织中的共晶含量增多,二次枝晶臂间距减小,而且初生相的形态也由粗大的树枝晶逐步向蔷薇状演变;通过520℃×5 h的固溶处理和200℃×8h时效处理,长条状的共晶硅被分解成短棒状甚至逐渐球化,合金的导电率提升了21.52%。
The influence of cooling rate and heat treatment process on the microstructure and electrical properties of Al-9.8Si-2Cu alloy was investigated by means of electrical conductivity measurement, metallographic observation and scanning electron microscopy. The results show that the eutectic content increases and the secondary dendrite arm spacing decreases with the increase of cooling rate at different casting temperature and mold temperature, and the morphology of primary phase gradually changes from coarse dendrites The evolution of rosette state was investigated. After the solution treatment at 520 ℃ for 5 h and the aging treatment at 200 ℃ for 8h, the long eutectic silicon was decomposed into short rods and even spheroidized. The conductivity of the alloy was increased by 21.52%.