论文部分内容阅读
采用正交试验的方法,研究了电脉冲处理对热镀锌镀层生长动力学的影响.以合金层生长速率时间指数为评价指标对电脉冲处理效果进行了优化.正交试验结果表明,电脉冲处理参数中电容量是主要影响因素,处理时间影响不明显,在电容量200μF,电压700 V,频率2 Hz,处理时间30 s的条件下作用效果较好.在此参数条件下的热镀锌实验结果表明:合金层的生长受到抑制,厚度减薄,组织变得均匀致密;合金层生长速率时间指数由0.717下降到0.428,合金层的生长方式由界面反应和扩散联合控制转变为仅受扩散控制.
The effects of electrical pulse treatment on the growth kinetics of hot dip galvanized coatings were studied by orthogonal test.The effect of electrical impulse treatment on the growth rate of the alloy layer was evaluated.The results of orthogonal test showed that electrical impulses The capacitance is the main influencing factor in the treatment parameters, the influence of the treatment time is not obvious, and the effect is better under the condition of the capacitance of 200μF, the voltage of 700 V, the frequency of 2 Hz and the treatment time of 30 s. The experimental results show that the growth of the alloy layer is inhibited, the thickness is reduced and the microstructure becomes uniform and compact. The growth rate time index of the alloy layer decreases from 0.717 to 0.428. The growth mode of the alloy layer changes from interfacial reaction and diffusion control to diffusion only control.