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利用等效磁壁而提出的半模基片集成波导能够将原基片集成波导的尺寸、重量减半,便于电路的小型化和集成化,因而研究这种结构在集成电路中的互耦现象十分必要。文中对同一个微波集成电路中相邻的两个半模基片集成波导以及改进的半模基片集成波导的互耦现象进行了仿真与分析。仿真结果表明,反向和同向排列方式受互耦的影响较小,并且改进后的半模基片集成波导结构能明显减弱互耦现象的影响。
The half-mode substrate integrated waveguide proposed by the equivalent magnetic wall can reduce the size and weight of the integrated waveguide of the original substrate to facilitate the miniaturization and integration of the circuit. Therefore, the mutual coupling phenomenon of such a structure in an integrated circuit is very much studied necessary. In this paper, we simulate and analyze the mutual coupling phenomenon of two adjacent half-mold substrate integrated waveguides and the improved half-mode substrate integrated waveguide in the same microwave integrated circuit. The simulation results show that the reverse and the same arrangement are less affected by the mutual coupling, and the integrated waveguide structure of the improved half-mold substrate can obviously reduce the influence of the mutual coupling phenomenon.