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基于3D元胞自动机方法实现了影像成形、曝光、后烘和光刻胶刻蚀过程等集成电路和微电子机械系统加工过程中的光刻过程模拟模块的集成.模拟结果与已有实验结果一致,表明基于3D元胞自动机方法的后烘和光刻胶刻蚀模拟模块的有效性,这对于实现集成电路和微电子机械系统的器件级的工艺模拟具有一定的实用性.
Based on the method of 3D cellular automata, the integration of lithography process simulation module in integrated circuit and microelectromechanical system processing such as image forming, exposure, post-baking and photoresist etching process is realized. The simulation results are compared with the existing experimental results The results show that the module based on 3D cellular automata can be used to etch and simulate the effectiveness of the module. This is of some practical application in device-level process simulation of integrated circuits and microelectromechanical systems.