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一九八五年六月底,日本电气推出了处理能力为每秒13亿次浮点运算、周期为6ns的超级计算机,其中使用了新的组装技术。主要的大规模集成电路,是用内部门延迟时间为250ps/门,功率在7W以下的1000门的大规模集成电路和存取时间为3.5ns的1K位存储器。把这种集成电路以载带自动焊接方式封装在带176个端子的小型芯片载体中,然后把36个这样的组件装在多层陶瓷基板上,并实行水冷。最后将这种模块平面组装在12块大型底板上,在组装的各个环节都要采取高速化措施。从芯片的pn结到冷却水的热阻大约控制在4.5℃/W内。在研制超大型电子计算机sx系统的过程中,对硬件系统要求之严格是空前的。一些主
At the end of June 1985, NEC introduced a supercomputer with a processing capacity of 1.3 billion floating-point operations per second and a period of 6 ns using a new assembly technique. The major LSIs are large integrated circuits with 1000 gates with an internal gate delay of 250ps / gate and a power of under 7W, and a 1Kbit memory with 3.5ns access time. The IC was packaged in a small chip carrier with 176 terminals by tape carrier soldering and then 36 such modules were mounted on a multilayer ceramic substrate and water-cooled. Finally, the module is assembled flat on the 12 large floor, in all aspects of assembly to take high-speed measures. The thermal resistance from the chip’s pn junction to the cooling water is controlled within about 4.5 ° C / W. In the development of ultra-large computer sx system in the process of the strict hardware requirements of the system is unprecedented. Some Lord