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1 适用范围本标准适用于挠性印制线路板用覆铜箔聚酰亚胺薄膜和聚酯薄膜(以下简称覆箔板)。注:(1)本标准引用标准如下: JISC5001 电子元件通则 JISC5603 印制电路术语 JISC6471 挠性印制线路板用覆铜箔层压板试验方法 JISC6480 印制线路板用覆铜箔层压板通则 JISC6512 印制线路板用电解铜箔注:(2)本标准对应的国际标准如下: IEC249-2-8(1987) 印制电路基材规范No.8挠性覆铜箔聚酯薄膜(PETP)
1 Scope This standard applies to flexible printed circuit board with copper foil polyimide film and polyester film (hereinafter referred to as foil). Note: (1) This standard reference standard is as follows: JISC5001 General rules for electronic components JISC5603 Printed circuit terminology JISC6471 flexible printed wiring board with copper clad laminate test method JISC6480 Printed circuit board with copper clad laminate General JISC6512 printed Electrolytic copper foil for circuit board Note: (2) The corresponding international standards of this standard are as follows: IEC249-2-8 (1987) Printed Circuit Board Specification No. 8 Flexible Copper Foil Polyester Film (PETP)