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针对化学微蚀刻法和微细电镀法制备微流控芯片金属模具进行了工艺对比研究。采用激光共聚焦显微镜分别检测表征由这两种加工工艺制备所得的模具微结构特征,对其侧壁陡度、尺寸均匀性、粗糙度进行对比分析。结果表明,化学微蚀刻法制备的模具微结构的侧壁呈不规则弧形、尺寸均匀性差,表面粗糙度较大(Ra=3.58μm)。而微细电镀法制备的模具微结构的侧壁则呈规则的梯形、尺寸均匀性好,表面粗糙度较小(Ra=0.65μm)。微细电镀法制备的微流控芯片金属模具综合效果比化学微蚀刻好。
Aiming at the comparison of chemical micro-etching and micro-plating method for preparing microfluidic die metal mold, Laser microscopy was used to characterize the microstructures of the molds prepared by the two processing techniques. The sidewall steepness, the uniformity of size and the roughness were compared and analyzed. The results show that the microstructure of the mold prepared by chemical microetching has irregular arc shape, poor uniformity of size and large surface roughness (Ra = 3.58μm). However, the sidewall of the mold microstructure prepared by the micro electroplating method has a regular trapezoid shape with good uniformity of size and surface roughness (Ra = 0.65 μm). Microfluidic chip prepared by micro-electroplating method is more effective than chemical micro-etching.