论文部分内容阅读
本文描述了用全息干涉计量技术检测焊点缺陷的原理。对热加载下焊点的缺陷、变形及干涉条纹的关系进行了理论分析。提出了判别焊点缺陷的准则。对焊点样品进行了检测,并进行了金相解剖。结果表明,对盘焊缺陷的检测成功率达96.8%。给出了实验装置及实验结果,并对实验结果进行了分析。
This paper describes the principle of holographic interferometry to detect solder joint defects. Theoretical analysis of the relationship between the defects, deformation and interference fringes under the thermal loading is carried out. The criterion of judging the defect of solder joint is put forward. Weld spot samples were tested and metallographic dissections were performed. The results show that the success rate of detection of defects on the plate welding is 96.8%. The experimental setup and experimental results are given, and the experimental results are analyzed.