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大规模集成电路有很多元件要有效地封装,芯片较大较重。设计芯片及其加工系统要考虑到芯片与芯片互相碰撞产生较大的动能。类似玻璃之类的绝缘涂层可保护芯片免受环境污染,但是,制造时大量芯片的碰撞却产生了问题。芯片与芯片的碰撞可实验测定其临界速度,低于这个速度,以一个芯片的棱角垂直撞击另一个电路的边沿,玻璃不会发生损伤,类似柯达薄膜抗蚀剂(KTFR)的涂层可避免加工损伤提供机械保护并适用于目前工艺及规范要求。
Large-scale integrated circuits have many components to be effectively encapsulated, the larger the chip heavier. Design chip and its processing system to take into account the collision between the chip and the chip to produce greater kinetic energy. Insulating coatings like glass protect the chip from the environment, but the collision of large numbers of chips at the time of manufacture creates problems. Chip-to-chip collisions can be experimentally measured at critical speeds below which the glass is not damaged by the edge of one chip hitting the other circuit edge vertically. A coating like Kodak's thin film resist (KTFR) can be avoided Processing damage provides mechanical protection and is suitable for current process and specification requirements.