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在日益激烈竞争的电子工业中,高成本效益、高可靠性的电子封装方案不单是电子产品发展的主要驱动力,甚至往往成为当中的促成科技(EnablingTechnology),用于轻巧、细小的无线电/可携带式消费性电子产品中尤见适合。其中更理想的性能效益(cost/performanceratio)、更短的产品开发周期、集多功能于一身的消费性电子产品亦是崭新科技应用的主要原动力。要达到以上目标,相关的微电子封装方案与焊接技术的进步是不可或缺的:例如从金属线焊接技术发展到倒装芯片技术,及至近年的晶圆级封装技术;从外围焊接(peripheral)发展到数组焊接(area-array);从陶制基版发展到有机基版;从单芯片封装发展到复芯片封装的构装方案等。事实上,系统级封装比一般的封装方案拥有一定的优势。在报告中首先概述最近在系统级封装的发展情况与应用。另外,借此报告突显出跟供应链有关产业之间的密切协调是达到有效而迅速地执行系统级封装的关键。最后,在报告中进一步详述一个集顶尖封装设计、分析及可靠性评估技术的服务中心的好处,及如何对工业界从事原型设计发展到大量生产的协助。
In the increasingly competitive electronics industry, cost-effective and reliable electronic packaging solutions are not only the main driving force for the development of electronic products, but also often become the enabling technology (Enabling Technology) for lightweight and small radio / Particularly suitable for portable consumer electronics. Among them, the more ideal cost / performance ratio, the shorter product development cycle and the combination of all-in-one consumer electronic products are also the main driving forces for new technological applications. To achieve these goals, the related microelectronic package solutions and advances in soldering technology are indispensable: for example, from the development of wire bonding technology to flip-chip technology and the recent wafer-level packaging technology; from the peripheral (peripheral) The development of array-area soldering (area-arrays); the development of ceramic substrates to organic substrates; the development of single-chip packages to multi-chip packages. In fact, system-in-package has some advantages over typical package solutions. The report begins with an overview of recent developments and applications of system-in-package. In addition, the report underscores the close coordination between the industries involved in the supply chain and the key to effective and rapid implementation of system-in-package. Finally, the report further details the benefits of a service center that brings together top-of-the-line package design, analysis and reliability assessment techniques and how to assist prototyping in industry to mass production.