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用扫描电镜(SEM)、硬度计、涡流电导率测量仪和万能试验机测试分别测量了在850~950℃固溶温度及400~500℃时效不同时间下对Cu-1.5Ni-0.6Si合金硬度及电导率性能的影响,用金相显微镜观察不同固溶温度下合金的组织。并对合金拉伸形貌断口进行了分析。探讨了合金的强化机理。结果表明:时效前随着固溶温度的升高,材料的硬度及电导率均随之下降,但电导率下降的幅度很小。随着固溶温度的增加,其再结晶程度越来越高,到900℃时组织已是完全再结晶组织,温度继续升高,晶粒会发生长大。时效析出为Cu-1.5Ni-0.6Si合金的主要强化手段。Cu-1.5Ni-0.6Si固溶后经不同温度时效后,时效初期硬度和电导率快速上升。随后硬度到达峰值后缓慢下降,而电导率继续上升。经过900℃×1 h水淬+450℃×2 h空冷处理后,合金得到良好的综合性能;其抗拉强度为780.7 MPa,伸长率为15.1%,电导率为40.2%IACS。
The hardness of Cu-1.5Ni-0.6Si alloy was measured by scanning electron microscopy (SEM), hardness tester, eddy current conductivity meter and universal testing machine. The hardness of Cu-1.5Ni-0.6Si alloy at 850 ~ 950 ℃ and aging time of 400 ~ 500 ℃ And conductivity, the microstructure of the alloy at different solution temperatures was observed with a metallographic microscope. The fracture of tensile profile of alloy was analyzed. The strengthening mechanism of the alloy was discussed. The results show that with the increase of solution temperature, the hardness and conductivity of the material decrease with the increase of the solution temperature before aging, but the decrease of the conductivity is small. With the increase of solution temperature, the degree of recrystallization is getting higher and higher. When the temperature is up to 900 ℃, the microstructure is completely recrystallized and the temperature will continue to rise and the grains will grow up. Aging precipitation for the Cu-1.5Ni-0.6Si alloy main strengthening means. Cu-1.5Ni-0.6Si solution after aging at different temperatures, the early aging hardness and conductivity increased rapidly. The hardness then drops slowly after reaching the peak, while the conductivity continues to rise. After 900 ℃ × 1 h water quenching + 450 ℃ × 2 h air-cooling treatment, the alloy get good overall performance; its tensile strength is 780.7 MPa, elongation is 15.1%, conductivity is 40.2% IACS.